ficonTEC Automated Micro-Optics Assembly AL-Series
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Features
- High-precision motion referencing and alignment
- Pick-&-place form/to standard/custom carrier formats
- Fully automated passive & fast-active 'align-&-attach'
- Epoxy & eutectic bonding, laser-assisted soldering
- OCR-compatible for component traceability
Product Information
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Manufacturer
ficonTEC -
Manufacturing process
Optoelectronic communication -
Series Products
A800/A1200/A1600/A2000 -
General tasks & applications
All optical element & chip-on-XXX 'align-&-attach' tasks - Fiber & waveguide assembly/ pigtailing/ connectorization
- Adaptable to high-complexity co-packaged applications
- For FTTX transceivers, HPLD modules, hybrid integration, MOEMS, PICs, silison photonics, co-packaged devices sensors and lidar, transport, IoT and 3D scanning.
